he Safest LED Beam Reflective Type Wafer Mapping Sensor

Conventional laser mapping sensors were dangerous as an operator is exposed directly to the laser beam that comes out of the load port through FOUP. With technological development, makers have succeeded in developing LED to adopt as a light source for M-DW1. So an operator’s safety is ensured when they use sensors with wafer cassette mapping.

Wafer mapping sensors are used to detect silicon carbide, sapphire, silicon, and other translucent wafers to speed up the sensing process while maintaining reliable detection.

The Position of the Sensor

Sensors are positioned in a way to sense the edge of the wafer front end at the same time. If any sensor detects a wafer edge, that wafer is not to be inserted in the same direction but likely to be inserted at an angle or cross slot.

Wafer mapping sensors are equipped with two detection modes, namely normal mode, and latch mode. The sensors are capable of detecting the latest high transmittance wafers at an edge and can detect mixed wafers like Silicon and glass wafers in a cassette.

In the wafer mapping sensor, each comb or sensor unit can be replaced in a single operation. Sensor units are easy to maintain and are cost-saving.

In addition to this, the sensors are electrostatic malfunction free. The combing unit contains only optical structures with no electrical parts proving to be very safe for people.

Power Supply

When you connect a standard switching power supply to the F3M-S, always ground the FG (frame ground) and G (ground) terminals of the power supply. At times, the F3M-S malfunction due to switching noise generated from the power supply if terminals are not grounded properly.

Connection and Mounting

Silicon wafer mapping sensors need a maximum of 24 VDC+10% to impose on the F3M-S safely. Always check whether the voltage of the power supply is within the permissible range before turning on the F3M-S. The power supply should be constructed in a way that the secondary circuit is insulated with an isolating transformer.

Never wire power lines or high-tension lines within the same channel of the wafer front end with the lines of the F3M-S, or the F3M-S as they may be damaged or malfunction due to induction. One must wire the lines of the F3M-S to separate power lines or high-tension lines in shielded conduit. One must also avoid mechanical impact while mounting the F3M-S, to reduce the water-resistant properties of the F3M-S.